Auction Calendar

Auction calendar for government securities

Event date Title
17-01-2019

Switch Operation

Bond(s) offered: 0.10 pct. DGB 2030i against buyback of 0.10 pct. DGB 2023i. Max. (issuance): 1.5 bln. DKK. Hedge ratio 1:1

Read more
23-01-2019

Government bond auction

Bond(s) offered at the auction: 0.50 per cent DGB 2029. At the auction, the total sale wil not exceed DKK 5 billion at nominal value.

Read more
29-01-2019

Switch Operation

Bond(s) offered : Announced at latest the trading day before.

Read more
30-01-2019

Treasury bill auction

Securities offered at the auction: T-bill 2019/I and T-bill 2019/II.

Read more
06-02-2019

Government bond auction

Bond(s) offered at the auction: Announced at latest three trading days prior to the auction.

Read more
12-02-2019

Switch Operation

Bond(s) offered: Announced at latest the trading day before.

Read more
13-02-2019

Treasury bill auction

Securities offered at the auction: T-bill 2019/II.

Read more
20-02-2019

Government bond auction

Bond(s) offered at the auction: Announced at latest three trading days prior to the auction.

Read more
26-02-2019

Switch Operation

Bond(s) offered: Announced at latest the trading day before.

Read more
27-02-2019

Treasury bill auction

Security offered at the auction: T-bill 2019/II and T-bill 2019/III.

Read more
06-03-2019

Government Bond Auction

Bond(s) offered at the auction: Announced at latest three trading days prior to the auction.

Read more
13-03-2019

Treasury bill auction

Securities offered at the auction: T-bill 2019/II and T-bill 2019/III.

Read more
14-03-2019

Switch Operation

Bond(s) offered: Announced at latest the trading day before.

Read more
20-03-2019

Government Bond Auction

Bond(s) offered at the auction: Announced at latest three trading days prior to the auction.

Read more
27-03-2019

Switch Operation

Bond(s) offered: Announced at latest the trading day before.

Read more
28-03-2019

Treasury bill auction

Securities offered at the auction: T-bill 2019/II and T-bill 2019/III.

Read more